Overview
Product specification
ST-100SW computer laptop tv screen repair acf tcp pcb ic fpc pdp cob cog fog tab cof lcd led tv Panel Repair machine
(1) cog fog fpc IC flex cable acf tab cof bonding machine
ST-100SW is our large bonding machine for bonding acf cof tab tape through a hot press pulse heating head during the process of repair lcd screen. It is widely used for led lcd tv screen panel repair and can solve screen display faults caused by COF damage.
There are 3 CCD cameras and pulse heating hot press bonding head in size 50*1.4mm. We also can provide bonding machine head in
other sizes like 68*1.4mm and 50*1.2mm.
(2) ST-100SW tv lcd led repair machine for bonding acf cof tab fpc cog fog
ST-100SW can repair TV screen up to 100 inches with an extensible glass platform. It also can repair 4K 8K TV lcd screen panel.
This model ST-100SW is in large size and easy for operation. It is a bonding machine with low price but good performance. It is our hot sell bonding machine.
(3) Bonding machine Spare parts
Spare parts are provided for repairing bonding machine in warranty. The Warranty for all our TV bonding machines is one year.
(4) automatic single head hot press pulse heating machine
(5) bonding machine accessories
The bonding machine price includes the cost of accessories. You only need to buy COF then you can operate the bonding machine and
start your TV repair.
- Additional Inspection Camera
Device Model | ST-100SW |
---|---|
Device Description | Screen repair equipment, LCD repair equipment, COF/TAB bonding equipment, etc. |
Device Uses | This product is used in a variety of FPC, COF, TAB and LCD Panel and PCB combination bonding, is reflected in a variety of sizes LCD vertical, horizontal, vertical band, horizontal belt, black belt, black, colored thread, ribbon , multi-line, black, black and white, vertical half display,horizontal half breakdown maintenance. |
Device Features | Single head ,single pneumatic device, single temperature control |
Applicable LCD panel specifications | 15″-100″(Platform expandable) |
Applicable LCD panel thickness | 0.3MM-1.1MM[Single glass] |
Panel type | TFT |
Bonding IC number | One/PANEL |
Bonding direction | X or Y Unidirection |
Bonding head size | Replaceable blade according to IC specifications (The original machine is equipped (50X1.2X10). |
Equipment process time | TFT,3.8S/chip |
Production beat | TAB,100pcs/H |
Bonding accuracy | ±1.5µm (support 4K) |
Highest positioning accuracy setting | ±0.5μm |
Equipment requirements work environment | Clean, dust-free, clean room |
Supply pressure | 0.1~0.7Mpa Dry air source |
Power supply | AC 220V±10%,50HZ,3500W |
Pneumatic device | Air TAC Original precision cylinder |
Pressure system | Pressure system parallel bar structure eliminates the weight of the indenter,pressure minimum accuracy can up to 0.1 KG,pressure components are using SMC precision components. |
Heating method | Pulse (rapid heating/cooling and auxiliary cooling) |
Temperature Control System | Room temperature time to 180 degrees the response time within 2-3 seconds |
Hot pressing head | Material: Titanium alloy Metal properties:SUS440C Plane precision (hot pressing surface) :0.001mm |
Thermocouple Type | K type Original US OMEGA wire |
Industrial control unit / programme | Panasonic PLC FX-C14T Panasonic Image Processing System |
Touch unit | Display control Samkoon dual-core touch screen |
Image unit | COF counterpoint: Down counterpoint (Optical Path: Lens> Quartz> ITO Electrode> COF) |
COF trimming unit | R stroke: coarse adjustment 360 degrees, fine adjustment +/- 5 degrees |
COF fixture | COF mechanical clamping type ,Z-direction tilt radius micrometer fine-tuning |
Lens spinner unit | Control mode: X / Y / Z micrometer control |
Silicone / Teflon | Manual switching position |
LCD stage (platform) | Manual slide movement,self-contained vacuum adsorption device |
Bonding head alignment | The cylinder can be set to stop in any position in the upper and lower directions |
Control method | Touch screen + button operation |
Parameter setting | Can store multiple sets of hot pressing parameters as needed |
Rated voltage | AC 180-220V |
Peak power | 400-1100W (can support 68X1.2X10 wide bonding head) |
Maximum power | 1100W |
Actual power | 580W |
Body size | 1800X1260x1550mm(L*W*H) 1160*850*1450mm(L*W*H) Without Platform size |
Net weight of equipment | 430KG |
Number of packages | 2 |
Equipment packaging | Wooden boxes, non-logs (material is glued board, no fumigation is required for export) |
Package size and gross weight | 1240X840X1680mm(L*W*H)337KG 1920X240X960mm(L*W*H) 110KG |